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UHMWPE Porous Membrane SUNMAP™

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The porous film provides breathability without altering the properties of UHMWPE. "SUNMAP™" is a high-molecular-weight polyethylene porous membrane developed by Nitto Denko using original special firing technology, cut from high-molecular-weight polyethylene powder bound into a porous sintered body. The porous film not only has new properties, such as breathability and low coefficient of friction, but also maintains the excellent properties of high molecular weight polyethylene, such as chemical resistance, abrasion resistance and stick elimination. With good processing properties, it has a wide range of uses, and the range of applications will continue to expand.

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UHMWPE Porous Membrane SUNMAP™

The porous film provides breathability without altering the properties of UHMWPE. "SUNMAP™" is a high-molecular-weight polyethylene porous membrane developed by Nitto Denko using original special firing technology, cut from high-molecular-weight polyethylene powder bound into a porous sintered body. The porous film not only has new properties, such as breathability and low coefficient of friction, but also maintains the excellent properties of high molecular weight polyethylene, such as chemical resistance, abrasion resistance and stick elimination. With good processing properties, it has a wide range of uses, and the range of applications will continue to expand.

Classification:

Wear Resistant Material

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  • Details
  • Product parameters
  • Applications

    Features:
    1. The porous membrane adopts open mesh, which has good air permeability and moisture permeability.
    2. By forming an ultra-high molecular weight polyethylene porous film with good wear resistance and low coefficient of friction, it has good sliding properties.
    3. It has chemical stability and is hardly affected by any acid, alkali and other chemicals.
    4. Thanks to the good processing performance, it can be used for heat sealing, punching and filling.

  • Characteristic:

    product number

    SUNMAP LC-T

    Thickness [mm]

    0.5

    Average pore size [µm]

    17

    Air permeability[sec/100cm3]

    1.4

    Porosity[%]

    30

    Tensile strength [Mpa]

    12

    Elongation[%]

    90

    Hardness [Shore D]

    48

    Surface Roughness (Ra) [µm]

    2.0

    Coefficient of friction

    0.1

    [Remark]

    * The above data are sample measurements, so actual performance cannot be guaranteed.

     

    Specification:

    product number

    Thickness [mm]

    Processing width [mm]

    Plate length [mm]

    Core type [10 m]

    Average pore size [µm]

    Porosity[%]

    feature

    LC

    0.1

    100-700

    100-1200

    17

    30

    • ・Basic level

    0.2

    0.3

    0.5

    1.0

    100-500

    100-500

    2.0

    LC-T

    0.1

    100-700

    100-1200

    17

    30

    • ·anti-static

    0.2

    0.3

    0.5

    1.0

    100-500

    100-500

    2.0

    LC-T5320

    0.2

    100-500

    100-500

    17

    30

    • ·anti-static

    • ・One side is flat

    0.3

    0.5

    1.0

    LC-T5320T

    0.22

    450

    450

    17

    30

    • ・Breathable and with adhesive

    • ·anti-static

    • ・One side is flat

    LC-TW1

    0.2

    600-1000

    available in rolls only

    17

    30

    • ・LC-T Wide

    • ·anti-static

    • ・Available in rolls only

    0.3

    0.5

    LC-TW2

    0.2

    600-1000

    600-1200

    17

    30

    • ・Better sliding characteristics than LC-TW1

    • ·anti-static

    • ・More than 600 points

    0.3

    0.5

    HP-5320

    2.0

    100-400

    100-500

    twenty four

    38

    • ·anti-static

    • ・One side is flat

    [Remark]

    * If you have questions about the size, please contact us

  • Application:
    1. 【SUNMAP LC】
    Suitable for absorbing/fixing glass materials, such as LCD.
    2.【SUNMAP LC-T】
    SUNMAP LC antistatic type.
    3. 【SUNMAP HP】
    Suitable for absorbing/fixing ceramic substrates.

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