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Double-sided tape TR series with ultra-high thermal conductivity and adhesive force

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Market price


TR series double-sided tapes use a thermally conductive adhesive and have outstanding thermal conductivity. Low heat resistance and super thermal conductivity.

Weight

kg

Quantity
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隐藏域元素占位

Double-sided tape TR series with ultra-high thermal conductivity and adhesive force

TR series double-sided tapes use a thermally conductive adhesive and have outstanding thermal conductivity. Low heat resistance and super thermal conductivity.

Classification:

Thermal Insulation Material

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  • Details
  • Product parameters
  • Applications

    Features:
    1. Low heat resistance and super thermal conductivity.
    2. Strong stickiness with remarkable holding power and reliability.
    3. Good usability and processability.
    4. The flame resistance of TR series tapes (excluding TR-5310EX) complies with UL-94 V-0 test standard.
    (Halogen Free) [Document No.: QMFZ2.E52859]
    5. Does not contain 6 substances prohibited in the Restriction of Hazardous Substances (RoHS) Directive.

     

    Structure:

  • Characteristic:

    product number

    TR-5320F

    TR-5325F

    TR-5310EX

    Thickness
    (mm)

    0.20

    0.25

    0.10

    Adhesive strength
    [N/20 mm]

    11.0

    11.4

    9.5

    Thermal conductivity*1
    [W/m K]

    1.0

    0.4

    Heat resistance
    [cm2·K/W]

    3.2

    3.5

    3.6

    Flame resistance
    [UL94]

    V-0

    -

    Substrate

    PET#12

    Flame resistance passed UL94 V0 test standard (halogen-free) [Document No.: QMFZ2.E52859]
    [Remarks]
    * At 300 mm/min, at 23°C and lined with 0.025 mm polyester, at 180° Measurements made while peeling in the direction.
    * The above data are sample measurements only, so actual performance cannot be guaranteed.
    *1 Laser flash method, 23°C

     

  • Application:
    1. Fix LED substrate and frame.
    2. Fix the CPU and radiator or heat sink.
    3. Fix various semiconductor packages and radiators.
    4. Fix the electronic components and heat sink.

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